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Embedded AI Vision Board
Home> Products >  Embedded AI Vision Board

Embedded AI Vision Board | RK3576 SoM/SBC — MV10-V1.0

Appurtenance:
  • Overview
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Description

MV10-V1.0 is a high-performance embedded motherboard built around the Rockchip RK3576 octa-core processor. It is designed to provide powerful and flexible hardware support for IoT devices, smart terminals, and multimedia applications. Leveraging the RK3576's advanced 8nm process, robust 6 TOPS NPU computing power, and next-generation ISP capabilities, the platform not only easily handles 4K UHD video encoding and decoding but also demonstrates exceptional performance in edge AI computing.

In terms of visual imaging, the MV10-V1.0 offers excellent compatibility and customization options. It widely supports a variety of mainstream and domestic sensors, including the GC2053, SC2336, IMX662, and IMX415. It can be flexibly tuned for actual application scenarios, supporting video resolutions ranging from 720P to 4K to meet diverse visual requirements in industrial inspection, security surveillance, and more.

Regarding software ecosystem and development experience, the MV10-V1.0 adopts a highly open strategy, providing a complete Linux SDK and comprehensive technical documentation. Developers can easily port algorithms and customize specific applications. Efficient secondary porting and development significantly shorten the product R&D cycle and accelerate project deployment. Whether for basic embedded learning or complex commercial development, the MV10-V1.0 stands as an ideal choice for developers to rapidly advance their projects, thanks to its outstanding performance and rich interface extensibility.

Application Scenarios

Visual-enabled terminal products in finance, media, payment, retail, industrial control, education, government/enterprise, and healthcare. It is well-suited for applications such as humanoid robots, smart retail, panoramic cameras, unmanned warehousing, intelligent picking and delivery, and automated drone equipment.

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Standard Parameters

Core Parameters
CPU Eight-core 64-bit processor (4×A72 + 4×A53), with a maximum clock speed of 2.2 GHz
GPU G52 MC3 @ 1GHz,support OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1
NPU 6 TOPS computing power NPU, supporting INT4/INT8/INT16/FP16/BF16/TF32 operations; capable of dual-core collaboration or independent operation; supports multitasking and parallel processing across various scenarios
ISP Equipped with a 16-megapixel built-in ISP supporting low-light noise reduction, an RGB-IR sensor, and up to 120 dB HDR. The AI-ISP enhances image quality with reduced noise.
Memory LPDDR4/LPDDR4x/LPDDR5 (4GB/8GB/16GB optional)
Built-in Storage eMMC (16GB/32GB/64GB/128GB/256GB optional)
Video Encoding Video Decoding:8K@30fps/4K@120fps (H.265/HEVC、VP9、AVS2、AV1)4K@60fps (H.264/AVC)
Video Decoding:4K@60fps (H.265/HEVC、H.264/AVC)
Image Decoding: 4K@60fps MJPG
Power DC 5V
OS Supports the RTLinux kernel with excellent real-time performance, widely used in industrial applications.
Supports Linux OS and Buildroot to provide a secure and stable system environment for product development and production.
It features new industrial capabilities such as real-time networking, Flexbus, hardware resource isolation, and DSMC, meeting diverse industrial application requirements.
Size 61mm × 40mm × 9mm
Support Camera 1-channel, 4-lane mipi interface: GC2053,GC2093,SC2336,IMX662,IMX415,AR0234,IMX566, etc., supporting customization
IMU Gyroscope 4 TDK series ICM42670 gyroscopes
Ethernet 1 × Gigabit Ethernet port (connected via an 8P-1.25 mm Wafer socket)
Wifi/ PDA Equipped with a built-in WiFi module supporting dual-band WiFi 6 (802.11a/b/g/n/ac/ax) at 2.4 GHz and 5 GHz, along with Bluetooth support.
USB 1 Type-C USB 3.0 external port (supports ADB)
Antenna Route 1
Push-button Button 1
Other Interfaces 1 UART channel, 1 Debug channel

Motherboard Size

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Interface Descriptio

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Precautions

Environmental Characteristics

Temperature

Operating: 0℃to +40℃

Store: -20℃ to +70℃

HumidityStore

Operating: 10% to 90% (non-condensing)

Store: 5% to 95% (non-condensing)

Altitude

Operating: 10,000 ft.(max)

Store:20,000ft.(max)

High Temperature & Storage

Test method &condition please refer to the description of GB2423.2 “Test Bd & Bb”

Low Temperature & Storage

Test method &condition please refer to the description of GB2423.1 “Test Ad & Ab”

Humidity &Temperature Test

Test method &condition please refer to the description of GB2423.3 “Test Ca” & GB2423.22“Test Nb”

Precautions for assembly and use

During assembly and use, please pay attention to and check the following (and not limited to) problem points:

  1. PCBA and electronic components are highly ESD-sensitive. Operators are required to wear ESD wrist straps or gloves before handling boards or assembly to ensure proper static dissipation.;
  2. During the installation and fixing process, avoid the motherboard deformation caused by the fixing reasons;
  3. Ensure correct MIPI interface alignment during camera installation. Verify the direction of Pin 1;
  4. B2B Connector Assembly:Follow the "mate first, screw later" sequence. Align and press the connectors to mate them fully before tightening the four corner screws. This ensures the connector handles vibration stress, while the screws mainly support the weight.;
  5. When installing peripherals (USB, IO, ETC), pay attention to peripheral IO levels and current output issues;
  6. When installing the serial port, pay attention to whether the RS232 and TTL devices are directly connected, whether the TX and RX connection methods are correct, and whether the level is correct;
  7. Whether the input power is connected to the power input interface, and whether the input power voltage, current, etc. meet the requirements according to the total peripherals.

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