8M imx219 fpc Camera Module Main parameters
|
Module Number |
XLS81830-V1.1 |
Sensor |
IMX219 |
|
Resolution |
8mp 4k |
Dimension |
Customizable |
|
Lens FOV |
87 (Optional) |
Focus Type |
Auto Focus |
|
Interface |
MIPI |
Feature |
High frame rate |
Products Description
The IMX219 8MP FPC camera module delivers 4K ultra-high resolution images with a size of 3296×2512 pixels. Its auto focus capability ensures sharp images for subjects at varying distances.
Equipped with a back-illuminated CMOS sensor, it provides high sensitivity and excellent low-light performance. The module supports high frame rate output: 720p at 120fps and 1080p at 30fps, ideal for dynamic capture.
Product highlights
8MP 4K ultra-high resolution for clear and detailed imaging
Auto Focus for precise focus on varying subjects
Back-illuminated CMOS sensor with high sensitivity and low-light performance
High frame rate output: 720p/120fps, 1080p/30fps
Product structure

Specification
1.Product introduction.
Features
●Back-illuminated CMOS image sensor Exmor R™
●2-wireserial communication circuit on chip
●CSl2serial data output (selection of4lane/2lane)
●Timing generator, H and V driver circuits on chip
●CDS/PGA on chip
●10-bit A/D converter on chip
●Automatic optical black (OB) clamp circuit on chip
●PLL on chip (rectangular wave)
●High sensitivity,low dark current, no smear
●Excellent anti-blooming characteristics
●Variable-speed shutter function (1 H units)
●R,G,B primary color pigment mosaic filters on chip
●Max.30frame/sin all-pixels can mode
●Pixel rate:280 MHz(All-pixels mode)
●720p/120frame/s,1080p(crop)/30frame/s
●Data rate:Max.755Mbps/lane
2.Specifications and features.
Total height: 4.1±0.2mm
Base size: 6.5*6.5±0.2mm
Image size: 3296*2512
IR filter: 650
Chip parameters.
◆CMOS image sensor
◆lmage size:Diagonal 4.60 mm (Type 1/4.0)
◆Total number of pixels:3296 (H)x 2512 () approx. 8.28 M pixels
◆Number of effective pixels:3296 (H)x 2480 (V) approx. 8.17 M pixels
◆Number of active pixels:3280(H)x2464 (V)approx. 8.08 M pixels
◆Chip size:5.095 mm (H)x 4.930 mm (V)(w Scribe)
◆Unit cell size:1.12 μm (H)x 1.12 μm (V)
◆Substrate material:Silicon
Product Picture

Application areas of camera modules
1.Ship monitoring system: Used for ship monitoring to ensure navigation safety and monitor ship status
2.Astronomical telescopes: Integrated with astronomical telescopes to capture images of distant galaxies and celestial bodies
3.Industrial X-ray inspection: Used for industrial X-ray inspection to detect internal defects of products and improve product quality
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